Used SMT Equipment | Chipshooters / Chip Mounters
Universal GX11 Pick and Place System With PTF Auction # 40 From Multiple Locations: www.xlineassets.com Key Equipment: • Universal HSP 4797L Chipshooter, SN 10085098, Includes (40) Assorted Feeders (15) HD0804, (15) HE0804, (3) HE1204, (3) HE
New Equipment | Solder Materials
DKL Metals have recently introduced their latest generation of Partner Paste formulations which have been designed specifically for use in Lead Free soldering. These pastes all give excellent print and reflow characteristics, tack life and stencil li
Cost effective automated stencil printer with SMTrue(TM) Vision Assist for precise alignment of stencil to PCB boards down to 12 mil ultra fine pitch components. Obtain high quality stencil printing of printed circuit boards with the SPR-45VA with S
New Equipment | Assembly Services
Flexible PCB Assy Services: Regular PCB assy, entire flow including PCB manufacturing, parts sourcing, completely PCB assy, and testing Partial PCB assy, we finish PCB assy on customers provided blank PCBs, or semi-assembled boards meanwhile prot
Career Center | Houston, Texas USA | Production
Electronic Assemblers / Solderers Temp to hire opportunity! $11 - $13/hour Job Responsibilities 1.) Solder rf, gps and gsm antenna, ps pigtail, fiber leds, buzzer 2.) IPC-610 or mil spec experience a plus 3.) Glue units together 4.) Cut open
Industry Directory | Consultant / Service Provider / Manufacturer
PFC Flexible Circuits Limited designs, manufactures, and assembles flexible circuits; single-sided, double-sided, multilayer and rigid flex. We are ISO 9001 and 13485 approved.
Used SMT Equipment | Pick and Place/Feeders
U block machine. The software is UPS+4.5.0 (windows 2000) 1 x Flexhead C41 .serial number C4PE535. (this is the high force head version, it just needs the spring
Technical Library | 2015-03-12 18:26:16.0
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are many ways to increase the packaging density and a few examples would be to stack them with Package on Package (PoP), fine pitch CSP's, 01005 and last but not least reduced component to component spacing for active and passive components (...)This paper will discuss different layouts, assembly and material selections to reduce component to component spacing down to 100-125um (4-5mil) from today’s mainstream of 150-200um (6-8mil) component to component spacing.
New Equipment | Assembly Services
25.0 um (>1mil) 6Max. Board Size: (580mm×1200mm) 7Min. Drilled Hole Size:4mil(0.1mm) 8Min. Line Width:3mil (0.075mm) 9Min. Line Spacing:3mil (0.075mm) 10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/
New Equipment | Solder Paste Stencils
Laser Cut Stencils: Industry trend toward miniaturization is leading to finer pitch requirements, high tolerances, and greater repeatability. Our state-of-the-art laser technology enables our customers to experience positional accuracy unattainable w
