Electronics Forum | Mon Jul 10 15:43:49 EDT 2000 | JAX
Mark, As far as what is the correct way; No Harm, No Foul! Adhesive bonding is more susceptible to damage caused in transportation of product; even from one side of the building to the other. This is why it is general practice to run it last��Smaller
Electronics Forum | Thu Jun 26 07:20:09 EDT 2003 | emeto
Hello, What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject
Electronics Forum | Mon Apr 02 10:50:39 EDT 2007 | CAN
We have simmilar probelms with a GSM. Lie to it and tell it there are less pins. If there are 6 pins on each side tell it there are 4 and to ingnor the outer 2. then it may miss the dot. Or have it look at just 2 sides like a SOIC.
Electronics Forum | Mon Oct 05 01:20:46 EDT 2020 | SMTA-64386317
No pre heat the board and only apply at 2 sided of component. Yes, there is bleeding but as long did not covered nearby component is acceptable. We are using UV oven for curing.
Electronics Forum | Mon Dec 08 14:40:08 EST 1997 | Rin Or
| First Responses Lost: Please Repost | | Looking for info on process flow for 2 sided SMT with PTH | | on the top side. | | Both sides have large SMT ICs. I don't know what the best approach is; | | Epoxy, Paste in Hole, High temp paste. | | Any in
Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton
I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c
Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Mon Oct 15 12:42:36 EDT 2001 | davef
I hate getting "roped" into math stuff, but here I go again ... Area of aperture = volume of paste / stencil thickness = {[5000 mil^3] / 5 mil} = 1000 mil^2 Side of the square aperture = Sqrt of the area = [1000 mil^2]^1/2 = 32 mil Diameter of ape
Electronics Forum | Tue Dec 04 09:35:58 EST 2001 | jdill
I have successfully reflowed 208,100 pin QFP'S and SOJ 28's on the bottom side of the board. The only thing i am "SCARED" to reflow on the bottom side are BGA'S. We used to turn off the bottom heaters but we did a trial run with them off and the boa
