Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Wed Jun 23 10:05:17 EDT 2004 | exmaintenanceleader
Hi Grant, I'm ex Fuji service engineer I install also at Sagem Czecz Republik (Kladnow near Prague) in 2000 they use at new lines MPM- 2XCP643E and 1xUniversal GSM (French owen (I do not remember the exacly tipe) at second hand line they use 2x and
Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Electronics Forum | Wed Mar 03 20:20:30 EST 1999 | Earl Moon
| We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 13
Electronics Forum | Tue Apr 27 23:10:16 EDT 2010 | mbrunton
I am looking at buying a pick and place machine to assemble the circuit boards we make. Most of the boards are small (2 to 10 square inches), most are 2 sided, and have maybe 20-50 parts per side. I use mostly 0805/0603 chips, SOT-23, SOD-123, SOIC
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