Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou
Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's
Electronics Forum | Tue Oct 24 17:01:20 EDT 2000 | Philip A. Reyes
Hi! Good day!! My questions is about PBGA rework the ff are: 1. Is it necessary to reball the plastic BGA module after removing it from the PCB? Can you give me the process and critical requirements?(e.i.stencil) 2.After removing the PBGA modul
Electronics Forum | Tue Apr 25 22:10:21 EDT 2006 | jaj
I tried the MS2 after listening to the claims from PK Metals. It was a distaster. What a mess. Everything was coated in a black soot and scum. We nearly lost a customer because the quality went down and we had so many problems. Steer away from this.
Electronics Forum | Tue Apr 04 10:22:00 EDT 2017 | charliedci
We're a little late in the game, trying to get our heads around RoHS 2. After some research it seems to me that the changes from RoHS are: 1)Traceability of PCB/components/production processes to verify RoHS. 2)CE/RoHS Marking on product. 3)Shorte
Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111
We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After
Electronics Forum | Mon Jan 07 13:28:56 EST 2019 | slthomas
Hi, I would like to try to help, but I think I need help in understanding your problem better. 1) do you see any discoloration of solder joints on the first side, after first side reflow? 2) after second side reflow, are solder joints on just the
Electronics Forum | Tue Oct 26 15:47:09 EDT 2021 | astarotf
Thanks Deni for the document, it is very valuable. I put the configuration that the document indicates to the machine and still the machine does not proceed to execute the SO / 2. After configuring it, we got these messages that I share in the foll
Electronics Forum | Wed Aug 12 13:38:52 EDT 1998 | Dave F
| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer
Electronics Forum | Fri Jan 27 11:03:53 EST 2006 | bvdb
We are a New Zealand company that purchased a used Fuji IP-1 locally. There is no Fuji support here but we've managed to get the IP-1 up and running with just the use of the manuals. There are many things that the manuals do not explain and I would
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
