Full Site - : 2.lead reflow sr108n (Page 2 of 3)

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Industry News | 2023-09-11 17:19:08.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.

Nihon Superior Co., Ltd.

Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024

Industry News | 2024-03-18 12:19:32.0

Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.

Nihon Superior Co., Ltd.

N2 & Lead Free

Electronics Forum | Mon Jun 05 11:42:17 EDT 2006 | smitty

A discussion started this morning an whether we need to add an N2 line to the reflow oven when we switch over to a lead free process. We will be using OA flux. Any thoughts?

TOMBSTONE DEFECTS

Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto

Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v

N2 & Lead Free

Electronics Forum | Mon Jun 05 14:28:45 EDT 2006 | marc

A few years ago with the 1st and 2nd generations of lead free material N2 was highly recommened. Now most of the materials suppliers have good formulations that are just fine in air reflow. I would still run a DOE though... just to be sure. Als

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev

Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas

BGA Reflow Profile

Electronics Forum | Tue Oct 30 06:20:58 EDT 2007 | aj

Hi All, I would appreciate some advise with regard to Leadfree settings for a 5 zone reflow oven. I have a 35mm square BGA 672 pin on board. I am struggling to get the Delta T down to 2 degrees C . I have 5 Thermocuples drilled up from the bottom a

Heller 1088 Reflow Oven Conveyor Adjust

Electronics Forum | Tue Dec 18 18:37:35 EST 2001 | Dreamsniper

Hi, Forgive me for my stupidity. Has anyone moved the fixed side of the Heller's Edge hold conveyor by 50mm ? I need infos on how they did it. This is because of the high delta T that we are getting from our oven which is between 20 to 20 deg. C from

Batch Ovens

Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP

Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe


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