| http://etasmt.com/te_news_bulletin/2020-05-04/15961.chtml
. The role of the cooling zone is to let the temperature drop to solidify the solder joint, and the cooling rate will affect the strength of the solder joint
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containing lead with liquidus temperatures under 350°C (662 o F). Although these low melt alloys do not stress the physical components the shear and tensile strength characteristics of these low temperature alloys are typically not used or suitable for