Electronics Forum | Fri Feb 01 14:49:52 EST 2013 | emeto
Thank you guys. You keep adding valuable information here. I think we will try to stick with the 3 times reflow(if we count the BGA repair as 2 reflows). However sometimes we will run the board second time through the oven(just flux the suspect part
Electronics Forum | Fri Feb 01 17:53:19 EST 2013 | hegemon
In agreement with Evtimov. Max 5 reflow cycles. Something like this scenario: Build bottomeside 1 Build topside 2 Reflow topside for suspect opens beneath BGA 3 Remove BGA during rework 4 Replace BGA during rework 5 Any convective rework after that,
Electronics Forum | Thu Dec 26 15:27:22 EST 2019 | emeto
Lead Free SMT 1. Stencil printer Squeegees s -should have Pb free pair 2. Reflow oven - should be able support Pb- free higher temperatures. 3. In case you have inspection table on the SMT line - should have Pb-free mats(usually different color)
Electronics Forum | Mon Dec 04 18:29:47 EST 2006 | SWAG
Some production problems we've faced: 1) Delamination; 2) Reflow fixture distortion; 3) Obsolete parts; 4) Failure of blower motor bearings in older reflow ovens; 5) Poor toe fillets with miniSOTs on thicker PCB's; 6) Lack of updated component data s
Electronics Forum | Mon Oct 14 17:23:36 EDT 2013 | markhoch
Thanks 'hege for the info. Have you seen a reduction in solder defects after switching from Air Reflow to N2 Reflow? I'm curious, because in my experience of over 20 years, working at five different companies, (Jabil being one of them), I've never u
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