Electronics Forum | Thu Apr 07 09:26:03 EDT 2011 | alcatel
Im trying to get the XY data to program the SMT machines. since i dont have the file, im trying to convert it from the gerber drawing. the closest one to represent the component placement is the solder pad. ive tried using linkcad to convert it to XY
Electronics Forum | Mon Sep 12 05:43:53 EDT 2011 | aungthura
Hi All We have run the Hast Burn-in-Board into 2 soldering Process,first-Reflow and second-Wave. After wave soldering, there are many insufficient solder in the via holes.The via holes are wide as 15mil. Then, as customer's request, we have to cover
Electronics Forum | Sat Jul 13 09:56:45 EDT 2013 | davef
Look here for guidelines http://www.sensata.com/supplier/pdf/CQI-17_Soldering_System_Assessment.pdf Special processes" refer to processes that produce outputs whose output cannot be verified before being released to the customer. These products and
Electronics Forum | Wed Jan 15 21:55:41 EST 2014 | padawanlinuxero
we do that and there's a variation on the solder temp. sometimes around 10 degrees, we have 2 solder pallets that are run in intervals of roughly 3 1/2 minutes a part (the time that take the operator to put all 3 terminals in a 42 pcbs per board, and
Electronics Forum | Tue Apr 26 09:29:26 EDT 2016 | davef
I've got good news and bad news: GOOD: I love Ag2 solder it's the best, most well behaved, reliable, couldn't ask for a better general purpose solder. BAD: It's leaded. I'd be concerned about embrittlement issues when soldering to gold that was 10 t
Electronics Forum | Fri Dec 27 11:42:18 EST 2019 | emeto
I could not see pictures of your board - please attach one or two. So to answer your questions: 1. wave should not overflow over your board - mostly we use pallets as carriers to protect the assembly. 2. Solder dross is caused because your wave is no
Electronics Forum | Thu Dec 22 10:52:32 EST 2011 | davef
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Electronics Forum | Thu Apr 15 08:21:47 EDT 1999 | Terry Keen
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Thu Apr 15 09:45:34 EDT 1999 | Terry Keen
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
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