Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Industry Directory | Manufacturer / Other
A small business that offers design engineers PCB prototypes with few restrictions. Our PCB's will be similar to the electrical characteristics and constraints that are being designed for and required in today's high speed and RF circuits. We offer up to 8 layers, hidden vias, over 20 choices of board thickness' and materials. Geometery as small as 4 mil lines & 4 mil spacing.
New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
Electronics Forum | Thu Aug 12 18:43:49 EDT 1999 | Wayne S.
Hello Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening 100 durometer blade. Getting "tails" on deposits. Trie
Electronics Forum | Fri Jan 08 16:31:05 EST 1999 | Jason Tomlinson
Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what acti
Used SMT Equipment | SPI / Solder Paste Inspection
2006 Orbotech Symbion P36 3D SPI. Nice machine! ◾Automatic Solder Paste Inspection ◾Max board size : 20 x 21 in. ◾Paste Height Range 50-300μm (0.2 – 12 mil) ◾Inspection speed : Up to 60 sq. cm/sec (9.3 sq. in/sec) ◾Height Accuracy / Repeatability 5 μ
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-06-05 08:11:23.0
Kerry co-solvent system pays for itself in 13 months
Parts & Supplies | Other Equipment
AI universal parts 40727505 46737003 SCRAP HOUSING ASSY, OFFSET 46737103 SCRAP HOUSING ASSY, "T" STYLE 46750601 COVER, CLINCH OFF 46750901 COVER, CLINCH VSL 46757801 PICKER AXIS MTR ASSY 46757901 X AXIS MTR ASSY 46758001 Y AXIS MTR ASSY 467
Parts & Supplies | Other Equipment
CGSTAPE-8258 - 1 mil polyimide tape with silicone high-temperature insulation tape, CGS offer 1mil, 2mil, 3mil and 5 mil polyimide tape with silicone. CGS can also offer different width such as 1/4", 3/8", 1/2", 1", up to 20", to meet customers' pr
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
Basically the machines I program and maintain at work. Pretty cool stuff! Our Philips Topaz and Emerald Machine building an SMT PCB. The Philips Topaz has 8 heads with vacuum that pick up components and place them on a bare PCB. The Philips Emerald
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Wylie, Texas USA | Engineering,Production,Quality Control
Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.
Career Center | Any location, USA | Engineering,Management,Quality Control
This Electronics Auditor position is an excellent opportunity for recent retirees or consultants that have experience with Printed Boards, Printed Board Assemblies, or Cable and Wire Harness Assemblies. To learn more about this opportunity click no
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | Fallbrook, California USA | Sales/Marketing
I have over 5 years of experience as the Asian Regional Vice President of Sales and Marketing for the Siemens SMT equipment division, over 7 years as the President of a small international Manufacturers Representative business selling SMT machines in
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JM-20 Sn63/Pb37 - 0.4 mm No Clean Leaded Flux Cored Solder Wire - PCBASupplies Login Create Account Contact View My Cart Menu
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
Atmosphere:Nitrogen Temperature:240°C Excellent Wetting at Toe Due to Nitrogen Small, acceptable voids 20 mil QFP Lead PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 18 of 24 Rev Level: 1 Rev Date: 1/03/01 Test # 10 Material
