Electronics Forum | Thu Feb 01 20:25:22 EST 2024 | jdengler
We do this often on smaller boards. More than saving money it reduces the storage space.
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Fri May 25 20:25:18 EDT 2001 | morefun
Thanks Dave, you were pretty quick on that response, and it was well taken. Cal or Wolfgang any thoughts or should I go find a rock to climb under?
Electronics Forum | Thu Sep 26 20:25:06 EDT 2002 | davef
When we DOE a board, we use the following independent print variables: * Print pressure * Print speed * Separation speed * Aperture orientation * Squeegee hardness
Electronics Forum | Fri Mar 12 14:20:25 EST 2004 | russ
MiniMicro stencil has stencils and a holder/aligner. I use their stencils but have not used their tooling. I use the eyeball align - tape and secure method. www.minimicrostencil.com Not affiliated with in any way. Russ
Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC
Check IPC-7095, 7.4.1.6 For Class 2, 45% of the diameter adn 20.25% for the area.
Electronics Forum | Fri Feb 11 08:20:25 EST 2005 | Rob
Depends what the joint is on, and how historically it has performed - ie. is it a part that won't wick on the wave, or near a ground plane that never forms properly. It may be that they know something you don't about the board. However any info s
Electronics Forum | Mon Aug 08 20:25:39 EDT 2005 | plcc
Hi Davef, I'm suspecting that too! The recipe we are using is the optimum for good soldering results. I'm checking with our supplier on the type of pcb material. Do you know the recommended material for pcb undergoing reflow, under ROsH condition?
