New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Used SMT Equipment | SMT Equipment
Sanyo X200, 210 Universal 4797A, 4797B x 2, 4797L x 2 For immediate sales customerst@163.com
Used SMT Equipment | Soldering - Reflow
Condition: Very good Temperature: 200-210 ° C baud rate: max. 1000 mm/min Power consumption: 36 kW
Parts & Supplies | Assembly Accessories
Mounter F4F5HS50HS60 D series Feeder accessories 2X8mm pressure cover improved 00309036-05 Off-the-shelf Sanyo X100X110X200X210 Feeder accessories 8*2 Feida connecting rod 630 095 8713 SMT placement machine F4F5HS50 HS60 D series Feeder
Parts & Supplies | Other Equipment
6ES7 312-1AD10-0AB0 6ES7 312-5BD01-0AB0 6ES7 313-5BE01-0AB0 6ES7 313-6BE01-0AB0 6ES7 313-6CE01-0AB0 6ES7 314-1AF11-0AB0 6ES7 314-6BF02-0AB0 6ES7 314-6CF02-0AB0 6ES7 315-2AG10-0AB0 6ES7 315-2EG10-0AB0 6ES7 315-6
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Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
) excessive pad size vs. the part’s terminal size, leading to the same effect. Te m p er at ur e (° C ) Preheat Preflow Reflow Cooldown Dwell at Liquidus 20 to 70 sec Dwell at Liquidus 20 to 60 sec 230 230 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 to 3 min 3.5 to 4 min 200° to 210°C b. a. Figure 1. The “standard” reflow profile (a
