Electronics Forum | Fri Feb 17 16:46:29 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level. For instance, in Cha
Electronics Forum | Fri Feb 17 16:50:58 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level.For instance, J-
Electronics Forum | Wed May 17 16:15:30 EDT 2006 | muse95
Try from this link. Then you just need to select the link for the pdf document. http://forum.europa.eu.int/Public/irc/env/dir_2002_95/library?l=/stakeholders_comments/individual_business/rohsusa_inc/jes00c337pdf/_IT_1.0_ Patrick's link didn't work
Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet
In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit
Electronics Forum | Tue Jul 25 21:27:05 EDT 2006 | davef
For information on CAF, look here: * http://www.cmap.ca/open/events/2002May_Reliability/presentations/Turbini%20CAF.pdf * http://eoeml-web.gtri.gatech.edu/jready/pdfs/reprints/publications/PRICM_1998/materialsperspective_short.pdf * http://www.ami.a
Electronics Forum | Thu May 23 22:17:47 EDT 2002 | davef
Not intending to undercut Mike's offer, but to compliment it. Consider asking Heraeus for guidance about cleaning the residues from reflowing your paste. Some NC flux res: * Cannot be cleaned. * Can be cleaned after a relatively short period of tim
Electronics Forum | Wed Jun 14 11:37:44 EDT 2006 | shawnvike
find the problem? Were the parts failing > electrically? Or did someone start prying them > and decide they were too weak? Originally found the problem going through some older assemblies that had failed testing. Poked at leads and found them no
Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef
We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C
Electronics Forum | Wed Oct 11 16:25:04 EDT 2006 | realchunks
Board fab, Defects, Pad coatings, Gold black plague articles 1 Nick Biunno's article: http://www.nukcg.org/downloadfiles/Hadco%20on%20Immersion%20Gold%20failures.pdf 2 George Milad's article: http://www.circuitree.com/ct/cda/articleinformation/featu
Electronics Forum | Sat Dec 02 11:35:30 EST 2006 | davef
Best dross remover is to not produce dross. Search the fine SMYnet Archives for previous discussions Dross will not increase signicantly * Another story, that lead-free solders will generate a greater volume of dross than conventional materials, is
