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Nitrogen lead-free reflow oven T200N

Nitrogen lead-free reflow oven T200N

New Equipment |  

A: Temperature control segment��40 segment The segment can be set in computer according to the actual requirement. B: Temperature-zone numbers :Single-zone and multi-segment C: Temperature control system��PC control system ,SSR non-contact output D:

Beijing Technology Company

Full hot air lead-free reflow Oven with six heating-zones TN360C

Full hot air lead-free reflow Oven with six heating-zones TN360C

New Equipment |  

A��Intuitional welding control: TN360C adopts advanced furnace temperature collection system. It can test temperature curve and temperature in furnace hearth. The temperature curve can be recorded or printed at the same time�� B��Smooth and safe tran

Beijing Technology Company

ESSEMTEC to Display RO300FC-C at APEX 2008

Industry News | 2008-03-19 14:49:56.0

Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will showcase RO300FC-C full convection reflow oven with RO-CONTROL software in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

Essemtec to Exhibit at Mexitronica 2008

Industry News | 2008-10-07 21:01:46.0

ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

ESSEMTEC AG

ESSEMTEC to Feature SP200-AV at APEX 2008

Industry News | 2008-03-20 15:46:19.0

Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

SEHO Presents New Reflow Technology at APEX 2008

Industry News | 2008-03-11 18:42:35.0

SEHO Systems is contributing a paper, "New Technology to Meet Challenging Reflow Requirements", to the technical conference at IPC Printed Circuit Expo/APEX/Designers Summit, April 1-3, 2008, in Las Vegas.

SEHO Systems GmbH

BTU�s Pyramax 100 Reflow Oven Wins 2008 Advanced Packaging Award

Industry News | 2008-07-19 14:06:23.0

NORTH BILLERICA, Mass., July 16, 2008�BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today was presented with an Advanced Packaging Award in the Reflow Equipment category for its Pyramax 100 reflow oven. The award was presented during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

BTU International

Datapaq Surveyor to be showcased at IPC/APEX 2008

Industry News | 2008-02-28 14:52:50.0

January 2008 � The Datapaq Surveyor will be showcased at the 2008 IPC/APEX tradeshow in booth #1438. The Surveyor provides and easy and accurate way to monitor the thermal performance of your reflow oven every hour, day and shift - effortlessly.

Datapaq, Inc.

Nihon Superior�s SN100C Wins 2008 SMT China Vision Award

Industry News | 2008-04-09 00:04:58.0

OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.

Nihon Superior Co., Ltd.

Nihon Superior USA to Showcase SN100C at Electronics West 2008

Industry News | 2008-01-23 10:09:33.0

OSAKA, JAPAN � January 22, 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will be showcasing its SN100C products with FCT Assembly, one of its US SN100C Global Partners, in Booth 128 t the upcoming Electronics West exhibition, scheduled to take place January 29-31, 2008 in Anaheim, Calif.

Nihon Superior Co., Ltd.


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