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New Technomelt® Material Streamlines Substrate Coating Processes

Industry News | 2016-03-27 14:19:07.0

Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.

Henkel Electronic Materials

Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business

Industry News | 2017-03-01 13:13:55.0

Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.

Henkel Electronic Materials

Seika to Showcase Routers, PCB Cleaners and More at SMTAI

Industry News | 2019-08-19 22:58:44.0

Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.

Seika Machinery, Inc.

Henkel Develops Thermally Conductive Technomelt® Solution

Industry News | 2016-03-30 09:04:09.0

Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.

Henkel Electronic Materials

Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award

Industry News | 2016-05-11 19:04:50.0

Henkel Adhesive Technologies’ Electronics business has named E-Tronix its 2015 North American Manufacturing Representative of the Year. This is the fifth time in six years that the company has earned this distinction, which Henkel awards to its top performing representative as measured against very stringent criteria.

Henkel Electronic Materials

Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017

Industry News | 2017-01-24 17:10:51.0

At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.

Henkel Electronic Materials

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Industry News | 2017-02-23 13:23:33.0

Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.

Henkel Electronic Materials

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Industry News | 2017-03-06 12:24:15.0

Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.

Henkel Electronic Materials

FINEPLACER® Micro Assembly Highlights at Productronica 2011

Industry News | 2011-08-30 20:10:58.0

At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.

Finetech

Nordson DAGE’s Evstatin Krastev, Ph.D. to present at SMTA International 20132D/3D X-Ray Inspection: Process Control and Development Tool technical paper to be discussed

Industry News | 2013-09-16 14:19:30.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.

Nordson DAGE


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