Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
Industry News | 2010-04-28 21:43:42.0
Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.
Industry News | 2010-05-04 21:09:23.0
Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Industry News | 2010-05-20 14:04:10.0
Wilsonville, OR, - Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the release of the vSure™ version 9.0 product, the successor of Valor Enterprise 3000™ Design-for-Manufacturing (DFM) product. The enhancements in this release enable designers to more easily perform extensive DFM analysis during the PCB design process, thus improving their productivity, avoiding costly design re-spins, and speeding the time to target high-volume production.
Industry News | 2010-08-17 14:46:57.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of Version 1.4 of its ispLEVER® Classic design tool suite. The ispLEVER Classic design software has been upgraded with the addition of Synopsys Synplify Pro with the HDL Analyst feature set, and an improved ispMACH® 4000ZE CPLD fitter with improved power optimization.
Industry News | 2010-08-27 15:08:50.0
Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology
Industry News | 2010-09-28 12:18:33.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a comprehensive video display interfaces suite for High-Definition Multimedia Interface (HDMI 1.3a), Digital Visual Interface (DVI), and 7:1 LVDS Interface. All of these display interfaces are available as free Reference Designs for the award winning, mid-range LatticeECP3™, while selected free Reference Designs can also be ported to the LatticeECP2M™ and LatticeXP2™ FPGA families.
Industry News | 2010-11-29 17:25:13.0
Lattice Semiconductor Corporation today announced the immediate availability of the HiGig™ MAC IP core for its award winning, low cost LatticeECP3™ FPGA family.
Industry News | 2011-05-27 22:28:49.0
Juki Corporation's KE-1070/KE-1080 modular placement systems have greatly exceeded sales forecasts since their release in late 2010.
Industry News | 2010-04-14 21:28:49.0
Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
