New Equipment | Solder Materials
Paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering. BGA packages and flip chip applications. Paste flux may be applied by screen or stencil printing, pin-transfer and syringe dispensing. Four types
The SMT magazine rack is designed for PCBs manufacture, assembly, storage and transfer。 Adjustable through screws,gear adjustment. Common type (60°C) and heat-resistance type(120°C ,160~200°C) are available. Surface resistance: 104~106 ohm. Base
The SMT magazine rack is designed for PCBs manufacture, assembly, storage and transfer。 Adjustable through screws,gear adjustment. Common type (60°C) and heat-resistance type(120°C ,160~200°C) are available. Surface resistance: 104~106 ohm. Base
New Equipment | Solder Materials
LF-1600 electronically temperature controlled soldering station with intelligent microcomputer chip control was developed to meet the present and future Lead-free soldering needs of the electronic production industry and suitable for work on professi
Industry News | 2010-03-04 11:12:24.0
Indium8.9HF-1 Solder Paste is a no clean Pb-free halogen-free solder paste that offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Industry News | 2010-08-04 21:14:00.0
Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.
New Equipment | Assembly Services
PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask - 2 layer, metal core board, hard gold plating 30u", with black solder mask. Advantages: - Metal core board. A PC board to be populated with electronic compo
Industry News | 2010-11-08 23:01:06.0
To complete the wide-ranging SIPLACE Excellence restructuring program and prepare for the planned transfer of SIPLACE’s ownership from Siemens AG to ASM Pacific Technology, SIPLACE Head of Development Günter Schindler has been appointed Chief Operating Officer (COO) of the global SIPLACE team effective October 1, 2010.
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Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
Industry News | 2010-10-29 23:38:34.0
BTU International will highlight its PYRAMAX™ series of reflow ovens at the upcoming SMTA Penang Vendor Show scheduled to take place on November 19, 2010 at the Eastin Hotel in Penang, Malaysia.
