Electronics Forum: 2023 exposure (4)

reflow/wave exhaust to outside

Electronics Forum | Fri Jun 23 17:33:15 EDT 2023 | davef

OSHA legally requires employers to: * Monitor air quality * Restrict exposure * Maintain hazardous substance level below Permissible Exposure Level (PEL)

Know of anyone using Screen Printer (opposed to Stencil Printer) in SMTA?

Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason

Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil

Used SMT Equipment: 2023 exposure (2)

Test Research (TRI) TR7007 3D Solder Paste Inspect

Test Research (TRI) TR7007 3D Solder Paste Inspect

Used SMT Equipment | SPI / Solder Paste Inspection

SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon

SMT Devices

Test Research (TRI) TRI TR7007 3D Solder Paste Ins

Used SMT Equipment | SPI / Solder Paste Inspection

TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe

SMT Devices

Industry News: 2023 exposure (1)

IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles

Industry News | 2022-09-14 07:08:12.0

IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles

Association Connecting Electronics Industries (IPC)

Technical Library: 2023 exposure (2)

Characterizing of Emissions from Open Burning of Electronic Waste using TG-GC-MS System

Technical Library | 2023-03-27 19:18:38.0

Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.

PerkinElmer Optoelectronics

The Effects of Silver Content and Solidification Profile on the Anand Constitutive Model for SAC Lead Free Solders

Technical Library | 2023-06-14 01:09:26.0

In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.

Auburn University

Events Calendar: 2023 exposure (11)

Chihuahua Expo & Tech Forum

Events Calendar | Thu Sep 07 00:00:00 EDT 2023 - Thu Sep 07 00:00:00 EDT 2023 | Chihuahua, Mexico

Chihuahua Expo & Tech Forum

Surface Mount Technology Association (SMTA)

Ohio Valley Expo & Tech Forum

Events Calendar | Thu Aug 17 00:00:00 EDT 2023 - Thu Aug 17 00:00:00 EDT 2023 | Independence, Ohio USA

Ohio Valley Expo & Tech Forum

Surface Mount Technology Association (SMTA)

Express Newsletter: 2023 exposure (116)

Partner Websites: 2023 exposure (33)

Guide to a Successful Lead-Free Soldering - Blackfox

Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/

new window Course Calendar Course Calendar 2024 Course Calendar 2023 IPC Certification IPC Courses IPC-A-600 IPC-A-6012 IPC-A-610 IPC-A-610 RECERT IPC/WHMA-A-620 IPC/WHMA-A-620 RECERT IPC/WHMA-A-620

Blackfox Training Institute, LLC

Exhibitor Information | IPC APEX EXPO 2021

| https://ipcapexexpo.org/exhibitors/exhibitor-information

, schedule one-on-one meetings with exhibitors and experience other offerings within the online exhibition. In order to provide you with optimal exposure for your brand, IPC has developed several advertising and sponsorship opportunities to help you connect and promote your products and services to virtual event attendees. Plan ahead


2023 exposure searches for Companies, Equipment, Machines, Suppliers & Information

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