Industry News | 2013-02-26 09:31:57.0
Hover-Davis announces expansion of AdoptSMT Europe GmbH sales and support distribution adding the countries of Austria and Switzerland to its territory that already includes the UK, Ireland, Czech Republic, Slovakia, Hungary, Romania, Slovenia, Croatia, Serbia, Bosnia, Macedonia, Greece and Malta.
Industry News | 2015-04-06 12:33:02.0
Viscom is one of the leading manufacturers of systems for optical and X-ray inspections. Currently, the company is equipping its successful X7056 system for automatic 3D in-line X-ray inspection with flat panel detectors. For combined AXI/AOI inspection, the system can also be assembled with an AOI unit and the high-performance module XM 3D. With these features, Viscom offers a one-of-a-kind inspection concept and the optimum X-ray inspection for high-end applications: 3D square.
Industry News | 2015-04-22 14:57:26.0
CyberOptics® Corporation (NASDAQ: CYBE) announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its new SQ3000™ 3D Automated Optical Inspection (AOI) system. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The 2015 EM Asia Innovation Award is CyberOptics’ 20th industry award from the electronics industry.
Industry News | 2016-02-15 17:53:06.0
Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.
Industry News | 2016-02-17 17:43:57.0
Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.
Industry News | 2016-03-18 12:02:25.0
The MXI system X8011 PCB, constructed by Viscom in Germany and sold worldwide for many years, has undergone a thorough revision. Viscom is introducing the result, the X8011-II PCB, alongside other systems at the SMT in Nuremberg.
Industry News | 2017-10-12 15:10:33.0
From Nov. 14-17, 2017, at the world's foremost trade fair, productronica 2017, Viscom AG will present its cutting-edge solutions for optical inspection systems with 3D technology under the motto "Solutions for me." Close cooperation with customers and Viscom's decades of expertise have resulted in products that convince with very fast handling, excellent inspection results and the simplest operation. The new developments are focused on the challenges arising from increasing product changes and higher production volumes, miniaturization and Industry 4.0.
Industry News | 2008-09-09 18:15:32.0
Michelle Lim of Reed Exchibition discussing the upcoming GlobalTRONICS exhibition
Technical Library | 2017-01-05 16:55:11.0
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later, all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. Starting with SAC (SnAgCu) alloys as a baseline for lead free soldering, in the last years several specific alloys were developed in order to improve resistance to high temperature creep, vibration survival and the ability to withstand thermal cycling and thermal shock.The paper compares three different solder alloys and two flux chemistries in terms of void formation and mechanical / thermal fatigue properties. Void content and reliability data of the alloys will be presented and discussed in relation to the acceptance criteria of a Tier 1 /OEM automotive supplier. As a result, a ranking list will be presented considering the combined performance of the alloys. In order to analyze the void formation and mechanical behavior of different solder alloys and flux chemistry combinations, statistical methods are used.
Technical Library | 2013-08-22 14:28:58.0
Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.
