Industry News | 2008-04-09 14:34:22.0
GREELEY, CO � April 2008 � FCT Solder, a division of FCT Assembly, announces that it has been awarded a 2008 EMAsia Innovation Award in the category of Soldering Materials for the SN100C Paste. The award was presented to the company during an April 9, 2008 ceremony that took place at The Foyer outside the Grand Ballroom of the Shanghai Everbright International Hotel during Nepcon China 2008.
Industry News | 2015-09-23 16:47:32.0
Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.
Industry News | 2019-04-25 18:56:51.0
CyberOptics announced that it was awarded two 2019 EM Asia Innovation Awards in the categories of Test & Measurement/Inspection Systems – SPI for its SQ3000™ Multi-Function for AOI, SPI and CMM and Software Systems for its SQ3000™ CMM. The awards were presented to the company during an April 25, 2019 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2007-12-13 20:21:46.0
Agilent Technologies Inc. (NYSE: A) today announced the availability of GoldenGate Plus for RFIC simulation, analysis and verification. Agilent's GoldenGate Plus product line speeds the design of large-scale RFICs for wireless communication products.
Industry News | 2017-10-12 15:01:31.0
Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
Industry News | 2010-07-29 14:30:50.0
Torenko and Associates, a leading manufacturers’ representative organization specializing in the sales and marketing of premier electronic assembly equipment, production tools, test, inspection, and consumable products to the regional USA, announces that Jochen Lipp, CEO of IBL Technologies, will hold a Vapor Phase Solder seminar and onsite demonstration at the upcoming SMTA Houston Chapter meeting. The meeting is scheduled to take place Thursday, August 19, 2010 from 6-9 p.m. at TS3 Technology, Inc. in Stafford, TX. Torenko and Associates represents IBL Technologies in Texas and Mexico.
Industry News | 2010-08-02 13:26:31.0
Torenko and Associates, a leading manufacturers’ representative organization specializing in the sales and marketing of premier electronics assembly equipment, production tools, test, inspection and consumable products to the regional USA, announces that Jochen Lipp, CEO of IBL Technologies, will hold a Vapor Phase Solder seminar and onsite demonstration at the upcoming SMTA Dallas Chapter meeting. The meeting is scheduled to take place Friday, August 12, 2010 from 12-2 p.m. at Circuitronics in Irving, TX. Torenko and Associates represents IBL Technologies in Texas and Mexico.
Used SMT Equipment | Soldering - Reflow
Conceptronic HVA HT 102 High Velocity Convection Reflow Oven, Lead Free -HT-2, Pin Chain and Mesh Belt Conveyor, 20in Mesh Belt, 480V, Year 2006 AUCTION ITEM WWW.XLINEASSETS.COM
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
Industry News | 2010-04-22 20:32:49.0
MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE), a leading SMT inspection solutions provider, announced that it has been awarded the 2010 EMAsia Innovation Award for its SE500, a 3-D Solder Paste Inspection system. The award was presented to CyberOptics on April 21, 2010 at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2010.
