Electronics Forum | Tue Oct 24 13:52:06 EDT 2006 | ehess
we have an operator who is being prescribed to wear a bone growth stimulation system. Does anyone know if tis is ESD safe? Can he wear that on the production floor as long as he's grounded and have it stored inside his smock?
Electronics Forum | Tue Oct 24 14:58:08 EDT 2006 | ehess
the guy has a borken collarbone, and this "promotes healing by inducing a weak electrical current at the fracture site." The distributor says it's ok. I kind of wonder if it really is.
Electronics Forum | Tue Oct 24 16:30:18 EDT 2006 | jax
Without getting into an electrical field promoting bone growth... As long as he is grounded through heal straps and/or wrist straps, it should be fine. Although I imagine being grounded would neutralize the "Bone Grower"
Electronics Forum | Tue Oct 24 20:15:37 EDT 2006 | davef
Use a field meter to quantify the effect of having this bone growth stimulation equipment near ESD sensitive devices.
Electronics Forum | Tue Nov 21 11:07:24 EST 2006 | ratsalad
If anyone is interested, I've written a program to read the PanaPRO .pcb file and generate a Sanyo TCM-V850/UIC 4785 program. It sure beats entering the program manually.
Electronics Forum | Tue Nov 21 15:09:14 EST 2006 | ratsalad
Yes. I figure if someone can make use of it, they can have it.
Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq
Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!
Electronics Forum | Wed Nov 29 01:14:15 EST 2006 | fastek
I would hope you have already done this but in case you haven't I would suggest a career change..........determine which machine is causing the problem and then do a PM on it.
Electronics Forum | Wed Nov 29 01:20:44 EST 2006 | fastek
Guess- If a component drops at the camera the machine will not proceed to attempt to place it and drive the nozzle into a brick of solder paste. The line sensor will catch the fact there is no component on the nozzle and will retry to pick and place.
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
