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"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders

Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 20:30:22 EST 2006 | davef

Your customer is so poorly educated that you should decline their work, because this will not be the last time they waste your time with their cockamamey theories.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 14:49:54 EST 2006 | M. Sanders

Dave, Thanks - I couldn't agree with you more. Unfortunately, our "bean counters" have a different frame of mind.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Fri Dec 01 10:18:10 EST 2006 | realchunks

You're right Hussman, I kinda missed the follow thru on that one! Sorry for any confusion on my part boys. Huss, you going to APEX this year? We missed ya last year. L.A. this year....boo!

Lead-free and Leaded solder in the same reflow

Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj

how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe

Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.

Trouble loading a program on Amistar 5630 and 5720

Electronics Forum | Tue Jun 13 08:27:19 EDT 2006 | wrongway

Hello Mark level 4 error need to header initialize its under program data as far as mdI01 error looks like a flag field error check the F field for the item codes or fiducial codes. MDI03 error fiducial mark is not aquired need to aquire the f

cost analysis: Manual vs. Auto insertion pick and place

Electronics Forum | Mon Aug 07 04:06:36 EDT 2006 | Rob

Also company B may have far higher overheads to support - sales guys, directors, accountants etc. They may also be set up for longer runs so as Ms Chunks previously mentions, the set up & teardowns would also incur the opportunity cost of not being

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Thu Oct 05 02:34:49 EDT 2006 | c_nguyen

Hello Everyone, I am new in this field and looking for an advice for choosing a screen printer between a DEK 265GSX and a MPM UP3030. Would you kindly give me your pros and cons between the 2 machines in terms of technical superior, ease of use, reta


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