Full Site - : 20in and 2006 (Page 52 of 56)

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Thu Oct 05 13:00:33 EDT 2006 | john_smith

CN, I forgot a couple things. The DEK printers are easy to program at about 3-5 min. The MPM is a little more difficult to program and it takes about 20-30 min. Resale value is also in DEKs favor. Just look around in the equipment section and see all

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Thu Oct 05 19:00:42 EDT 2006 | SWAG

We've always been MpM so no comparison from me on DEK. All I can say is we have had 3000 series that seemed to need constant attention and almost daily wrenching. We got a couple of AP25 HiE's and they are easier to use, way more reliable and simpl

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Thu Oct 05 20:48:06 EDT 2006 | darby

We run Dek ELAs and MPM UP1500, Everyone here prefers the Deks. Set up, software, maintenance, operation etc. There's not a lot in it - the guys just prefer the Deks. However we are an OEM and so get control on board design, finish, fiducials etc. So

Advice Needed between a DEK 265GSX and a MPM UP3030!

Electronics Forum | Thu Oct 05 21:14:08 EDT 2006 | chrisgriffin

I'm with Chunks on this. In my experience MPM's are very accurate and reliable. There are so many out there because people like them. You can make a program with 2D inspection in about 10 minutes. Things do sometimes break on the 3000's, but not

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip

Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco

Inline Aqueous Wash for WS and RMA fluxes

Electronics Forum | Fri Dec 08 10:24:11 EST 2006 | pjc

The Speedline Technologies- Electrovert AquaStorm 200 is one machine that can do the trick. You'll need the Chemical Isolation option for the RMA flux and you'll need a cleaning chemistry like what Zestron and Kyzen have. Yes, hi-density boards with

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 02:08:47 EST 2006 | adeline_ko

Hi, What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing? We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersio

Lead-free and Leaded solder in the same reflow

Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir

Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -

Lead-free and Leaded solder in the same reflow

Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike

At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit


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