Electronics Forum | Thu Oct 21 21:07:13 EDT 2021 | llawrence
Hi, Early this year, the company I work for released its first product using PCBs with SMT assembly. These boards are relatively simple with less than 30 components, mostly 0603 size resistors and capacitors with a few SOIC and one LQFP chip. These
Electronics Forum | Wed Oct 26 06:36:33 EDT 2005 | rlackey
Hi Ken, We would build a one off with an exact number of components on a different line, in a different manor completely to a volume, chipshooter job - however, we'd only really be doing a one off like that if it was a prototype as we're not in that
Electronics Forum | Mon Jun 22 21:31:43 EDT 1998 | Dave F
| Dear collegues, | I like to have your comments/ experience with various methods of depanelization like routing, scoring, cutting etc. | Any feed back on the equipment used with company addresses will be highly appreciated. | Please identify if pos
Electronics Forum | Mon Sep 21 18:37:10 EDT 2009 | sbayeta
Hi, Our SMT line has placement capacity of 80K cph, but only 21K cph gluing capacity. The rate between reflow and glue of our products is around 5 to 1. The line works great for the reflow boards, but when we produce glue boards the glue dispenser
Electronics Forum | Tue May 02 23:34:26 EDT 2006 | Frank
The 2060RE model that I have can do an 18"x20" board. I think the Mydata can do larger. Juki did tell me that next year they will release a machine that will do larger boards but didn't specify on how big. The 2060RE can do 0201 up to 74mm square
Electronics Forum | Thu May 17 21:50:29 EDT 2007 | jeremyl
Hi All. We are a tiny startup company developing an IC in a flip-chip CSP package. We find ourselves in need of being able to remove and replace (ie rework) our chip on a characterization board. The board will not be big and the chip is very small
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Fri Apr 08 09:32:09 EDT 2005 | bystrom123
We are using a low end Air vac system to place the BGA's. We have X ray we can use. Our CGA's as well use this system. They are one off parts that are above the 20K a piece range. So I have been tasked with making sure all of these procedures are the
