Industry News | 2023-09-25 19:05:05.0
The Murray Percival Company proudly unveils its latest promotion, spotlighting its range of depanelizers. Known for exceptional performance and efficiency, these high-quality depanelizers are now readily available, complemented by spare blades and expert blade sharpening services. Often dubbed as "pizza cutters" because of their precision cutting mechanism, these depanelizers signify a blend of cutting-edge technology and precise engineering that adds unmatched value to electronics manufacturing processes.
Industry News | 2019-09-20 08:45:31.0
09.19.2019 – Boca Raton – “Having worked in the electronics manufacturing industry since graduating from University of Maryland in 1980 with a BSEE, it’s truly puzzling to me that sophisticated machines capturing so much data have not been used to their full potential”, says Frank Mascetti, Owner of Technical Resources Corporation (TRC). For decades, he has witnessed this with respect to semiconductor test systems to In-Circuit Test to assembly and inspection machines alike. When he transitioned from electrical engineering into his sales profession many years ago, he listened to “spinmeisters” who worked very hard on creating a story with sales collateral. The companies acted like “it’s simply magic” and we can “plug all these boxes into one another.” In short, “Industry 4.0 will solve everything.”
Industry News | 2009-07-12 14:16:52.0
MORRISVILLE, NC - July 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, is pleased to announce outstanding sales incentives on all its remaining KE-2050, KE-2060, and FX-1 machines in stock. The incentives include attractive pricing discounts, cash credit for early payment, and leasing assistance to include 0% interest leases on certain models.
Industry News | 2010-05-14 07:53:24.0
Sensor manufacturer VEGA implements SIPLACE Facts
Industry News | 2020-02-19 21:52:03.0
In the week leading up to the Oscars, Koh Young was busy on the APEX 2020 red carpet, making appearances in the various shows being filmed on the expo floor. Here are a few of the highlights, or as they say at the Oscars, here are this year’s nominees...
Industry News | 2021-02-15 09:25:46.0
Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, will participate in a free panel discussion on Tuesday, 23 February 2021 at 10:30AM EST. Register today and secure your seat in the virtual event to learn from Koh Young and others how to optimize the box build assembly process.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2009-12-09 19:47:15.0
For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
