Industry News | 2015-09-03 17:09:35.0
Saki Corporation announce the grand opening of their new facility in Fremont, California. An open house is being held on September 10, 2015, from 10:00AM to 6:00PM. Special demonstrations of Saki's true 3D and 2D automated optical inspection and measurement equipment will be available and Lean Stream will demonstrate Fuji's AIMEX IIS flexible placement platform.
Industry News | 2013-11-05 10:04:10.0
Marquardt GmbH of Rietheim-Weilheim (Germany)uses the Viscom S3088 SPI3D solder paste inspection system.
Industry News | 2022-04-11 21:59:08.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2023-10-31 18:47:22.0
Koh Young will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.
Technical Library | 2013-04-18 16:46:42.0
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Industry News | 2023-05-22 18:44:12.0
Since adding Scienscope's range of inspection solutions to its portfolio, Altus Group, a leading supplier of capital equipment for the electronics industry, has seen increasing interest in their technology. With the launch of Xspection 3000 this year, the success story is set to continue.
Technical Library | 2021-12-29 19:37:20.0
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests.
Industry News | 2021-08-30 08:58:05.0
Atlanta, GA - As a firm believer in the power of a smart factory, Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is a session speaker and Platinum Sponsor at the upcoming eSMART Factory Conference on 22 and 29 September 2021 in Coventry, United Kingdom. The first day is an in-person event with a focus on advanced automation systems, which concludes with a tour of the fully integrated CFX production line at the MTC. That CFX line includes the Koh Young 8030 solder paste inspection (SPI) and Zenith automated optical inspection (AOI) systems, which were the very first inspection systems to achieve the challenging IPC Qualified Product List (QPL) certification. The second day is a virtual event focusing on Industry 4.0, supply chain, and next-generation materials. This annual event brings together leading technologists and engineers who will present, discuss, and debate the future of Industry 4.0 technologies. Register today at esmartfactory.net.
Technical Library | 2021-11-22 20:32:10.0
The aim of this work is to define a procedure to develop diagnostic systems for Printed Circuit Boards, based on Automated Optical Inspection with low cost and easy adaptability to different features. A complete system to detect mounting defects in the circuits is presented in this paper. A low cost image acquisition system with high accuracy has been designed to fit this application. Afterward, the resulting images are processed using the Wavelet Transform and Neural Networks, for low computational cost and acceptable precision. The wavelet space represents a compact support for efficient feature extraction with the localization property. The proposed solution is demonstrated on several defects in different kind of circuits.
Technical Library | 2021-06-07 19:03:05.0
The waste from end-of-life electrical and electronic equipment has become the fastest growing waste problem in the world. The difficult-to-treat waste-printed circuit boards (WPCBs), which are nearly 3−6 wt % of the total electronic waste, generate great environmental concern nowadays. For WPCB treatment and recycling, the mechanical−physical method has turned out to be more technologically and economically feasible. In this work, the mechanical−physical treatment and recycling technologies for WPCBs were investigated, and future research was directed as well. Removing electric and electronic components(EECs) from WPCBs is critical for their crushing and metal recovery; however, environmentally friendly and high-efficiency removal techniques need be developed. Concentrated metals rich in Cu, Al, Au, Pb, and Sn recovered from WPCBs need be further refined to add to their economic values. The low value added nonmetallic fraction of waste-printed circuit boards (NMF-WPCBs) accounts for approximately 60 wt % of the WPCBs. From the perspective of environmental management, a zero-waste approach to recycling them should be developed to gain values. Preparing polymer composites and geopolymers offers many advantages and has potential applications in various fields, especially as construction and building materials. However, the mechanical and thermal properties of NMF-WPCBs composites should be further improved for preparing polymer composites. Surface modification or filler blending could be applied to improve the interfacial comparability between NMF-WPCBs and the polymer matrix. The NMFWPCBs shows potential in preparing cement mortar and geological polymers, but the environmental safety resulting from metals needs to be taken into account. This study will provide a significant reference for the industrial recycling of NMF-WPCBs
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