Electronics Forum | Thu Sep 20 15:02:36 EDT 2007 | pjc
You do not always need test points designed on the board. Any ICT supplier will consult with you on that and after looking at your designs. Teradyne offers new and refurb'd systems for ICT, analog only or w/ Vectorless testing to ensure ICs have a co
Electronics Forum | Thu Sep 25 07:45:41 EDT 2014 | emcglobaltechnologies
Good morning, I hope you are doing well today, please allow me to introduce myself. My name is John Wasserman and I am the Sales Manager for EMC Global Technologies. We manufacture fixtures and tooling for the processing of printed circuit board ass
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Sat Mar 30 17:27:45 EST 2002 | davef
You should not have glue "all over the place." Tou should not have glue on solderable surfaces. It sounds like you are stringing glue from one dispense location to the next. Search the fine SMTnet Archives [there might be something there]. Read a
Electronics Forum | Tue Sep 20 21:49:51 EDT 2005 | davef
2251 - Design Guide for the Packaging of High Speed Electronic Circuits 2252 - Design Guide for RF/Microwave Circuit Boards
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu Jan 27 08:52:05 EST 2000 | Todd A. Braun
We currently use a silicon conformal coating on many of our manufactured circuit boards and are experiencing situations where the coating doesn't conform. For example, on the sharp edges of components and corners of leads it pulls away before curing
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