Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
Electronics Forum | Thu Jan 04 15:39:07 EST 2007 | dyoungquist
While the 85% yield on a per board basis seems low, we are actually running over 99% yield on a per solder joint basis as there are about 17,700 joints per panel. On average, 9 out of 63 boards in the panel need rework. Rework issues include missin
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Thu Jan 04 20:31:21 EST 2007 | Ben_T
Have you thought about an AOI system? With the system we have where I work, I'm able to run queries that'll tell me DPMO, yield, and pass/fail rates on a board level, part level, and opportunity level. Furthermore, this data can be broken down to see
Electronics Forum | Wed Oct 08 00:28:31 EDT 2008 | khushi
Dear, Flexkhushi > Do you mean 2 mm thick board or .2 mm board. If > you are talking .2mm then you are refering to a > flex circuit correct? What equipment will you be > using to place the 01005 component? I am not sure > if you can even place a
Electronics Forum | Fri Dec 15 08:00:57 EST 2000 | Pete B
John, We regularly wave solder electroless silver finished boards (Alpha Level)with mixed SMD and through hole parts and do not have any problems. We have changed a number on PCB's from HASL to electroless silver, mainly for the benefits at SMD whe
Electronics Forum | Fri Jan 05 22:10:45 EST 2007 | fastek
Craig- Your point assumes most if not all of the problem lies in inferior equipment. I understand your point but I believe that an excellent process can overcome the fact that you don't have brand new and pristine equipment. As an example you can
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Thu Jan 04 17:04:43 EST 2007 | slthomas
99% good solder joints = 10000 ppm (defects per million opportunities). Having only built with 0603s I can't speak for a target but that still seems pretty harsh....with a 75/25 0805/0603 ratio at my last place of employment I think we were running
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
