Welcome to the next generation in PWB test solutions. We combine an exceptional team of technology and applications experts with HIOKI's industry-leading systems to enhance your reliability and to speed up your product development process.
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Sun Aug 21 15:54:15 EDT 2005 | Ken
not to be anoying....but a topaz can be configured with a 54mm camera an when using the 20 micron head 1 spline. It will place accuratly to +/-0.02mm Imagine 1 machine that works from 0402 to 54mm square! Now that's flexible.
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Industry News | 2018-10-18 10:24:59.0
Printed Circuit Board Solder resist
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Parts & Supplies | Assembly Accessories
FUJI-sw-micro-PZ02394 electron microscope 3.5-90X Magnification HD HDMI/USB 14MP Camera electron microscope 3.5x-90x stereo microscope MICRO EJECTOR UNIT KM8-M7162-00 MICRO PHOTO SENSOR THETA-AXIS J3212027A J3212027A Micro Switch S5
Parts & Supplies | Assembly Accessories
50 EZ3-278-945-01 RETAINER (B) NOZZLE SPRING 51 EZ3-681-308-02 BOLT (M2X6) HOLE HEXAGON 52 401-55919 SPRINNG(1)_TORSION 53 401-56290 GEAR_RN(4 54 401-56291 GEAR_RN(5) 55 401-56612 RETAINING RING CURICENT TYPE(5103-46) 56 401-56640 HEXAGON SOCKE
Technical Library | 2016-10-03 08:28:47.0
With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
