Electronics Forum | Fri Jul 09 07:17:25 EDT 2010 | cobar
http://www.shanelo.co.za/List%20of%20articles/GOLD%20Soldering.pdf http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
Electronics Forum | Thu Sep 02 22:39:58 EDT 2004 | davef
Comments are: * Few of us use IR reflow. It has been replaced by convection or a combination of convection and IR. * Follow the recommendations of you paste supplier in determining the initial thermal recipe for your oven. * Look here to learn more
Electronics Forum | Sun Feb 24 10:15:41 EST 2008 | teamcanada
Issue cross talk \Stencil thickness recommendation? 3-4-5 mil Using manufactures recommended paste layout Water soluable vs No clean Paste. Any recommended publications? Only one found so far is Fairchild, recommend NC due to potential cleaning issue
Electronics Forum | Tue Sep 02 22:03:03 EDT 2008 | davef
Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Mon Sep 08 13:44:19 EDT 2008 | davef
Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Mon Apr 16 09:58:55 EDT 2007 | davef
"Although some lead-free pastes performed adequately and newer pastes work better than earlier formulations, this detailed experiment confirmed that tin/lead solder pastes wet back to PCB pads better than lead-free solder pastes. Therefore, a more ac
Electronics Forum | Fri Jun 27 08:41:40 EDT 2014 | hungikuo
Is it safe to let Au80Sn20 reflow twice? What I am saying is, for example, die attach using Au80Sn20, followed by lid seal using same Au80Sn20 solder, will it create any problem on the die which was first attached using same soldering material? My
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Wed Jun 11 10:27:33 EDT 2003 | caldon
Frank-In addition (Dave gave some good scoop) we use a Pyrex Glass board to run through the wave. This is useful as you can see through the board .....you can watch the flux coverage, preheat, and Wave (be it Chip, lamda, or??) as it goes through the
