Industry News | 2023-11-20 15:39:15.0
Heraeus Electronics is proud to announce its receipt of the prestigious 2023 GLOBAL Technology Award in the category of Solder Paste. The award highlights the contribution made by Heraeus Electronics' Microbond® SMT660 Innolot® 2.0 solder paste. The award was announced during an award ceremony that took place at productronica in Munich on Nov. 14, 2023.
Used SMT Equipment | Pick and Place/Feeders
(2) Universal Advantis Pick and Place Systems Universal Advantis Placement System; Product Code: 4982B; AC-72; FlexJet 9 Head; Universal Advantis Placement System; Lightening Head; Product Code: 4983A; With Assorted Nozzles in Nest Auction Ite
Used SMT Equipment | In-Circuit Testers
Takaya APT-9411cj Flying Probe Tester; August 2006 Auction Item: www.xlineassets.com Auction Starts Soon! Other Available Equipment Via Auction: Auction Starts Soon - Complete Factory Closure 4) SMT PRODUCTION LINES INLCUDING: (1) DEK INFI
Industry News | 2023-09-11 17:31:10.0
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Industry News | 2024-03-18 12:13:13.0
Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.
Industry News | 2023-10-30 19:10:41.0
Heraeus Electronics is pleased to announce that it has been honored with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean. The award recognizes Heraeus Electronics' contribution to the automotive industry with its Microbond® SMT660 Innolot® 2.0 Solder Paste. The award was announced during a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Industry News | 2023-02-27 18:30:26.0
Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics' proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.
Industry News | 2016-03-09 11:23:40.0
CAMI Research Inc. (Acton, MA) announces a new board for its CableEye cable and harness testing systems. Populated with solder pads to accept a suite of TE-Connectivity™ Micro-MaTch connectors, the board addresses markets plagued by vibration and fretting corrosion, and requiring “miniaturized connectivity”. Rated to 500Vdc/350Vac, the CB49 may be used on all CableEye models.
Industry News | 2023-10-09 09:27:44.0
Printed circuit board assemblies (PCBAs) and integrated circuits (ICs) are the focus of NEPCON Asia, which will be held October 11-13, 2023, in Shenzhen, China's southern hub of electronics innovation. Germany's Viscom AG will be represented by a select Asian team and four of its many advanced inspection systems: S3088 ultra chrome for 3D SPI, S3088 ultra chrome as a 3D AOI configuration, iX7059 PCB Inspection XL from Viscom's large 3D AXI portfolio, and the X8011-III 3D MXI system.
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