Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Wed Jun 11 10:27:33 EDT 2003 | caldon
Frank-In addition (Dave gave some good scoop) we use a Pyrex Glass board to run through the wave. This is useful as you can see through the board .....you can watch the flux coverage, preheat, and Wave (be it Chip, lamda, or??) as it goes through the
Electronics Forum | Fri Apr 22 11:21:42 EDT 2005 | HUH
There are several types of lasers to do laser soldering. Panasonic also has a high intensity light that can solder as well. I've tried em' all and two over whelming things stand out when it comes to this type of soldering. #1 is preheat. It seems
Electronics Forum | Wed Oct 11 09:53:06 EDT 2006 | Rob
Yes, kind of - I had a look through my notes from a while back where we did a lot of work on bending strenght but the only original source I could find was reference to a paper drawn up in 1979 "Increase Terminal to Pad-Peel Strength with a Standard
Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef
Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Sat Dec 03 08:15:41 EST 2005 | davef
Welcome Here for articles on developing reflow recipes: * http://www.process-heating.com/CDA/ArticleInformation/features/BNP__Features__Item/0,3156,18454,00.html * http://www.smtinfo.net/Db/_Reflow%20Soldering.html * http://www.smtinfocus.com/proc
Electronics Forum | Mon Feb 20 15:03:56 EST 2006 | davef
Q1- Will we be able to select the materials (flux and alloy) and run the process depending only on ourselves, distributors� help, machinery documentation, web data and �trial and error?� A1- Your materials suppliers [eg Kester, Alpha Metals, etc] wil
Electronics Forum | Tue Dec 04 14:31:50 EST 2007 | davef
Search the fine SMTnet Archives for previous discussion. This technique has been called 'pin-in-paste,' 'paste-in-hole,' 'intrusive reflow,' 'alternative assembly and reflow technology' and who can remember all the other consultant buzz-words. Look a
Electronics Forum | Tue Jul 19 08:12:23 EDT 2005 | davef
We agree with Rob. It looks like either kiss is blowing the paste around. It could be: * Nozzle id too large. * Kiss is occuring after the head has moved from the component. 0408%20MS%2001.jpg - Paste is not missing on the bottom-center pads. It is
