Industry Directory | Manufacturer
Service. Quality. Flexibility. Integrity. These are the cornerstones that have earned Cirtronics a reputation of excellence in the electronic manufacturing services (EMS) industry.
Industry Directory | Research Institute / Laboratory / School
Southeast University is one of only 32 universities directly administered by the Chinese Department of Education, which are considered the top class universities in China.
New Equipment | Cable & Wire Harness Equipment
Overview The SealCrimp 210 B is a highly flexible benchtop machine for stripping, sealing and crimping a great variety of different wire sizes up to 2.5 mm² (14 AWG). The machine can process a great variety of crimp terminals and seal types includin
SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
Electronics Forum | Fri Jan 19 13:35:59 EST 2001 | Claude_Couture
Hi John! Found one in the local flea market. Made in 1987 and picture looks like new! Amazing!
Electronics Forum | Thu Mar 01 17:56:18 EST 2007 | darby
Tested recently on ENIG finish. profile as follows 100-150, 57 sec. 150 210, 46 sec. 210 + , 63 sec. Peak 231. This profile was developed for this paste as per Asahi literature. Operator said it "looked wet and smelled good"! Print quality was excel
Used SMT Equipment | Pick and Place/Feeders
2004 Mydata MY 12 SMT Pick and Place Power: 210 / 121VAC; 3 Phase Machine Dimensions: 132" x 48" x 60" Features: Electrical two-pole test Optical Centering HYDRA; HYDRA High Speed Z High Speed; Autoteach Line Scan Software Version 2.4.6b
Used SMT Equipment | SPI / Solder Paste Inspection
Product Name: Table Top 3D SPI Model Name: KY3020T Serial Number: SPI-2T 210 Voltage: 220Va.c, 1Phase, 50/60HZ Rated Current: 0.8 Amp Current Max.: 4 Amp SCCR: 10KA/220Va.c Capacity: 0.88 kW Weight: 95 Kg Machine Size (mm): 780 x 1100 x 734 IP Grade:
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2013-03-04 16:08:13.0
IPC and the industry, Karen McConnell, Northrop Grumman, and Linda Woody, Lockheed Martin, earned IPC Presidents Awards at IPC APEX EXPO® in San Diego.
Parts & Supplies | SMT Equipment
ETA switch of DEK Printer Model :1410-L210-L2F1-S02-5A Model :1410-L210-L2F1-S02-3 .45 A
Parts & Supplies | SMT Equipment
ETA switch of DEK Printer Model :1410-L210-L2F1-S02-5A Model :1410-L210-L2F1-S02-3 .45 A
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Make: DEK Model: Horizon 01 Vintage: 2004 Details: * Green Camera * 2D Inspection * Adjustable Frame Size * Under Stencil Cleaner * Internal Vacuum * Edge Clamp * Support Pins * Windows NT O/S * 210v – Single Phase – 60Hz Co
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Career Center | Austin, Texas | Sales/Marketing
New Business Development Manager - Austin, Tx Tired of not getting paid for sales deals you've closed or being cheated out of your commissions? Have the desire to work for a fast paced, global electronics manufacturer that pays you for every deal yo
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QLP-3619-210-32BK Quantum Storage Systems Buy Online Login Create Account Contact View My Cart Menu × Categories Hand Soldering
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