Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Thu Oct 14 12:02:44 EDT 1999 | Larry Johnson
I was wanting to know if there was any type of formula that I could use to determine the correct packaging for a SMD For example, if I have the component measurements, can I find out what the correct width and pitch of the tape it comes in should be
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Thu May 09 00:08:01 EDT 2002 | techment
Could someone provide help regarding IPC's recommendation on Plated Through hole's --- lead to hole ratio. I can't find it in IPC-2221 and IPC-SM-782. Thank you very much
Electronics Forum | Wed Jul 07 17:47:00 EDT 2004 | davef
For bare board design for test, try: * IPC-2221 - Generic Standard On Printed Board Design * Section standard for the board type [eg, IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards]
Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef
Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.
Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS
Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS
Electronics Forum | Wed Jul 06 20:40:40 EDT 2005 | davef
Voltage does not flow. Current flows as a result of a change in voltage. Current capacity of traces * Graph is IPC-2221 paragraph 6.2, Figure 6.4 * http://www.geocities.com/CapeCanaveral/Lab/9643/TraceWidth.htm
Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef
Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards
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