 Proximitor 位移(速度加速度监测器模块)3.jpg)
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef
Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes
Electronics Forum | Wed Feb 22 20:33:25 EST 2006 | davef
Here's your design rules: * IPC-2221 * IPC-2222 Bonus is that they include the works, not just break-away tabs
Electronics Forum | Wed Dec 13 20:30:59 EST 2000 | Dave F
Immersion Silver PCB Surface Plating - Dennis VanBuren 14:21:24 02/01/2000 [Wudja mean "not much luck" searching the archives? What is this haggis???][Is that like saying "what is this chopped liver??"]
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Thu Oct 14 12:02:44 EDT 1999 | Larry Johnson
I was wanting to know if there was any type of formula that I could use to determine the correct packaging for a SMD For example, if I have the component measurements, can I find out what the correct width and pitch of the tape it comes in should be
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
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