Electronics Forum | Thu May 09 17:24:11 EDT 2002 | davef
First, SM-782 elates to surface mount pads. So, expecting to find PTH design rules there is a bit of a stretch. Search the fine SMTnet Archives for similar threads. For instance here�s one from last week: http://www.smtnet.com//forums/index.cfm?fu
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed May 30 17:49:49 EDT 2001 | davef
You are correct. IPC wants you to pay for that standard, regardless if you get a hard copy or download it. Generally, it�s pretty boring stuff for production types. [Although, you will recognize some of the goofy things your designers have done to
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan
I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info
Electronics Forum | Tue Sep 26 15:48:32 EDT 2000 | Dave Hulbert
I'm a bit confused about reading IPC-275 (I know I should have IPC-2221/2222) but I'm sure they are similar. Anyway, I am doing a: Military, less than 100V, non-conformal coated PCB, External Etch Sec 5.3.1.4 Edge Spacing.. (Pg 61) says use Tabl
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef
I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I
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