High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Industry News | 2003-05-16 08:23:59.0
A novel PCB socket block features integrated crossconnections, which facilitate daisychaining of supply voltage and signal lines in multiboard applications, saving installation time and money.
Industry News | 2003-03-17 09:40:03.0
Omnimate BLZ/BLZF 5.08F PCB connectors have integral screwed flanges to ensure safe and secure connection under the most severe vibration conditions.
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2003-05-05 09:21:23.0
Features a 50% Reduction in Length
Industry News | 2019-08-21 16:55:59.0
MIRTEC will exhibit in Booth #305 at SMTA International. MIRTEC will showcase the latest advancements in their award-winning 3D AOI and SPI Systems at the two-day event.
Industry News | 2019-09-23 16:01:19.0
MIRTEC will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The MIRTEC team will showcase the all new MV-6 OMNI 3D AOI Machine and award-winning MS-11e 3D SPI Machine.
Industry News | 2018-09-17 19:37:42.0
MIRTEC, “The Global Leader in Inspection Technology,” announces plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will premier its award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems Booth #208.
Used SMT Equipment | SMT Equipment
Model:YV10011SMT machine Placement Speed: Chips :14400cph(0.25sec/chip) Placement Range:0402 chips ~25mm Placement Station:100 Power Supply:3P/200V-415V/3KVA Dimensions:1650X1358X1810mm Weight:1300kg jenny@ksunsmt.com
.gif)
