The Lansmont PDT-56ED is the enhanced version of the PDT-56. This Drop Tester is perfect for those applications where drop heights are frequently changed or heavier packages need to be tested. The PDT-56ED features an electric hoist for raising and
New Equipment | Assembly Services
Wave soldering out plate connection (hole) SMT feeder workbench This product whole bracket produced by using aluminum alloy material, beautiful appearance, durable; Wave soldering out plate feeder for wave soldering machine and automatic producti
Electronics Forum | Wed Dec 06 15:22:07 EST 2000 | Christopher Lampron
Does anyone know of documented inspection criteria for inspecting BGA's post reflow? (e.g. void percent, alignment, etc..) Any help would be greatly appreciated Thanks In Advance Chris
Electronics Forum | Wed Dec 06 20:56:19 EST 2000 | Dave F
Why sure, we use WI-10-02-05, BGA Inspection Criteria, bgainsp.doc, 00, 9/15/99, based on an article in Evaluation Engineering Magazine, Sept �99, p130.
Used SMT Equipment | SPI / Solder Paste Inspection
Sw level: 2.7.9 Configured with: (4) side view cameras (2) top down cameras , 1 each: Standard camera Power: 120 Vac Condition: Complete and Operational, available for inspection prior to shipment. Availability: Immediate Location/Shipping:
Used SMT Equipment | AOI / Automated Optical Inspection
Yestech F1 AOI Vintage: 2006 Details (1) Standard Resolution Top Down Camera (1) Hi Magnification Top Down Camera (4) Side View Camera White/ Red LED Lighting YesVision V2.7.9 Software Condition: Complete & Operational Locat
Industry News | 2011-03-11 14:53:57.0
A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.
Industry News | 2011-06-29 16:18:11.0
IPC recently submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding the legal basis for a phase-in of the conflict minerals regulatory requirements.
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Parts & Supplies | Screen Printers
Product Name: P3251; P4720 old driver card connector Part Number: P3251; P4720 Description: P3251; P4720 old driver card connector, 5PIN, male and female mating connector Applicable models: AP UP Printing Presses P3251; P4720 old driver car
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Parts & Supplies | Screen Printers
Product Name: P4720; P7775 MPM TACTILE driver card Part Number: P4720; P7775 Description: P4720; P7775 MPM TACTILE driver card, MPM STEPPER MOTOR DRIVE CARD Applicable models: AP UP Printing Presses P4720; P7775 MPM TACTILE driver card, M
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Dimensions: 11.0" x 1.0" x 11.0" (27.9 cm x 2.5 cm x 27.9 cm) Weight: 1 lbs 1.0 oz (0.5kg )
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer: Siemens Part number: 6DP1360-8BA Description: S
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | Dallas, Texas USA | Engineering
Production Engineer-PCB Assembly: BS required, Experience in full-line support of SMT, T/H; NPI / DFM tools. Position pays between 50-60K. If you are interested please send resume to mpeter@emsr.com
SMTnet Express, January 28, 2015, Subscribers: 22,279, Members: Companies: 14,195 , Users: 37,607 BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications Vern Solberg, Ilyas Mohammed - Invensas Corporation
