New SMT Equipment: 2a64 and bubbles (8)

China PCBA and Electronic Contract Manufacturing Factory

China PCBA and Electronic Contract Manufacturing Factory

New Equipment | Assembly Services

Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board 

Shenzhen Kingsheng PCBA Tech CO.,Ltd.

Current and Voltage Sensors epoxy potting machine

Current and Voltage Sensors epoxy potting machine

New Equipment | Dispensing

About 2 part silicone Metering, Mixing and Dispensing System The 2 part silicone Metering, Mixing and Dispensing System accurately meters, mixes and dispenses two-component materials like potting compounds, encapsulants, casting materials and adhesi

Guangzhou Daheng Automation Equipment Co.,LTD

Electronics Forum: 2a64 and bubbles (7)

Imm Silver and Voiding

Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN

We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Used SMT Equipment: 2a64 and bubbles (1)

Universal Instruments 5362i and 5362T

Universal Instruments 5362i and 5362T

Used SMT Equipment | Conveyors

Make:  Universal Model:  5326i Description:  Conveyor Quantity: 9 Dropbox Link to additional photos: https://www.dropbox.com/sh/nqv1ir96ajyzsyi/AADVxqoxweToNOACXPnyg5Fta?dl=0 Make:  Universal Model:  5362T Descrip

Lewis & Clark

Industry News: 2a64 and bubbles (11)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies

Industry News | 2014-09-06 17:51:35.0

IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

What is a vacuum reflow oven ? What is the difference between vacuum reflow welding and vacuum reflow welding?

Industry News | 2019-12-16 22:35:33.0

Vacuum reflow oven is to conduct high-quality welding for products in a vacuum environment to protect products and solder from being oxidized under the condition of vacuum, and to react the oxide of products and solder surface at the same time to improve the quality of welding surface and reduce the void rate of welding.

Beijing Technology Company

Technical Library: 2a64 and bubbles (2)

Moisture and Bubble-Free Material Preparation in Larger Quantities

Technical Library | 2018-09-10 08:44:08.0

Issue: Moisture and bubbles in your dispensing material with larger quantities Solution: Scheugenpflug’s 55-gal Barrel Agitator Station Barrel agitators for casting resins take their technology from the paint sector. They fall short of meeting the special demands of the auto, medical, aeronautics and electronics industries. They can’t guarantee a solid seal on the barrels – often containing expensive, moisture sensitive resins – allowing the humidity of the surrounding environment to damage the material. Also, conventional barrel agitators, as opposed to smaller units, cannot work in a vacuum to process materials directly.

Scheugenpflug Inc.

Coatings and Pottings: A Critical Update

Technical Library | 2021-08-11 01:00:37.0

Conformal coatings and potting materials continue to create issues for the electronics industry. This webinar will dig deeper into the failure modes of these materials, specifically issues with Coefficient of Thermal Expansion (CTE), delamination, cracking, de-wetting, pinholes/bubbles and orange peel issues with conformal coatings and what mitigation techniques are available. Similarly, this webinar will look at the failure modes of potting materials, (e.g Glass Transition Temperature (Tg), PCB warpage, the effects of improper curing and potential methods for correcting these situations.

DfR Solutions (acquired by ANSYS Inc)

Videos: 2a64 and bubbles (3)

LiquiPrep LP804 - The new standard for material preparation and feeding

LiquiPrep LP804 - The new standard for material preparation and feeding

Videos

Harnessing gravity LiquiPrep variant uses gravity for high-viscosity materials The higher the viscosity of a material, the greater the demands it places on its preparation and feeding in dispensing systems. But the trend right now is to use viscou

Scheugenpflug Inc.

LiquiPrep LP804 - The new standard for material preparation and feeding

LiquiPrep LP804 - The new standard for material preparation and feeding

Videos

The new LiquiPrep material preparation and feeding unit https://www.scheugenpflug-dispensing.com/en/news/press-releases/article/the-new-liquiprep-material-preparation-and-feeding-unit-415.html Scheugenpflug has launched a new generation of its prov

Scheugenpflug Inc.

Express Newsletter: 2a64 and bubbles (12)

Partner Websites: 2a64 and bubbles (244)

Acceptability of Conformal Coating Bubbles | EPTAC

| https://www.eptac.com/soldertips/acceptability-of-conformal-coating-bubbles/

. Is Figure 10-131 a Defect Photo? Other than stripping and re-coating , if bubbles are encapsulated would they be considered an acceptable Process Indicator or a Defect? *Image (excerpt

FLOware Info and Error Messages Reference Guide

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Messages-Reference-Guide-22100026.pdf

FLOware Info and Error Messages Reference Guide Messages Reference Guide Version 1.1 November 28, 2016 Part No. 22100026 for FLOware

GPD Global


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