Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
MODEL NAME :HPX-1300S - LED Screen Printer with 2D Inspection Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Variou
Used SMT Equipment | AOI / Automated Optical Inspection
The AOI can be used as: Inline inspection unit Offline inspection unit Pre-Reflow-Inspection Post-Reflow-Inspection 2D-Solder-Paste-Inspection good running condition
MODEL NAME: HP-350MD ; HP-620MD Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various PCB Clamping options depend
Industry Directory | Manufacturer
Manufacturers of Automated Optical Inspection
Used SMT Equipment | Screen Printers
DEK Horizon 03Xi Screen Printer Available Vintage: 2011 Maximum Stencil Size Capacity 29”x29” Photos Available Upon Request Camera Type: Green 2D Solder Paste Inspection Tooling: Quick Tool Vacuum Board Support Snugger PCB Edge Clamp SW Version: 09 S
Industry Directory | Manufacturer / Other
Gen Pack Assembly is a contract electronics manufacturer providing PCB assembly, testing, and box-build integration for your mid volume & high mix productions. A trusted partner for over 25 years, Gen Pack is proudly ISO:9001
The SP-1 is an in-line 100% 2D and sampled 3D solder paste inspection system designed for SMT manufacturers. The SP-1 provides highly accurate and repeatable measurements of stencil offset and skew, as well as solder paste area, height and volume.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
