Industry News | 2013-02-25 18:32:14.0
Equipment Services, LLC has introduced a new line of ESE US-X Series solder-paste printers to the North American PCB assembly market. The advanced-technology SMT screen printers, which feature 2-D solder-paste inspection as standard, are built in Korea to the highest level of quality.
The XACT 4 automatic screen and stencil printer is specially designed to perform any kind of production demands within the electronic industry, and therefore paying special attention to its universal usage. The XACT 4 features the exceptional EKRA ea
Used SMT Equipment | Screen Printers
Speedprint SP700 avi Specs: WATCH the performance of this system NOW on our website under VIDEOS Description: This machine is as new so we will provide Installation, training and full FIVE YEAR warranty. * High Precision Axes Linear rail & bel
MIRTEC: Automated Optical Inspection Systems Tabletop and In-Line AOI Systems 15 Megapixel 2D/3D MV9 AOI Series Five Camera Technology 2D/3D Inspection Capability / 3D OMNI-VISION / 6 Phase Color Lighting System Intelli-Scan For Lift
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of 3D Solder Paste Inspection(SPI), PCB Substrate Inspection, Flip Chip Bump Inspection, LED Package & Substrate Inspection Equipment, Software Development and Solutions.
Technical Library | 2023-11-20 18:10:20.0
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations.
Used SMT Equipment | Screen Printers
08/29/2008 MPM Speedline Technologies Momentum Solder Paste Screen Printer, 220VAC Single phase power and clean dry shop air required. Windows O/S, 2D Inspection, L to R Board Flow, Sinlge conveyor with Edge Clamp, Solder Paste Dispense, Venturi Va
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
HP-520SPI Load a new program in 1 minute, 20 seconds Inspect a full size PCB in 8 seconds or less Closed Loop Feedback on X/Y, Theta, Insufficient-Excess Solder Paste and also Under Stencil Cleaning System
