For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.
This family of three air-actuated heads provides accurate force setting from 0.5lbs to 100 lbs. Extruded head mounts and built-in thermode co-planarity adjustment mean easy systems integration.
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Used SMT Equipment | Pick and Place/Feeders
Fuji AIm P&P Pacakge with 400+ Feeders, Vitronics Soltec XPM3-1030 Reflow Oven, Asys Conveyors! Make: Fuji Model: AIM Quantity: Three SW: V5.BZA Single lane Machine 1 Vintage: 2006 Heads: 4 @ H12’s, (4) Feeder Trollies Hours: 32
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Technical Library | 2016-08-24 06:15:35.0
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device.
Technical Library | 2020-02-14 14:43:21.0
To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Fri Jun 24 00:00:00 EDT 2022 | Neustadt, Germany
TechDays 22 - in person and online event
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
PCBA Cleaning Machine / PCB Defluxing -For Best Coating and Bonding Effect - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch
| https://www.eptac.com/ask/training-in-wire-bonding/
Training in Wire Bonding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
