When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
Electronics Forum | Thu Apr 07 14:11:33 EDT 2022 | SMTA-69080803
@Stephen How big was the adapter board? It's challenging to depanelize and tedious to manually put these tiny assemblies in a tray.
Electronics Forum | Thu Mar 31 15:53:23 EDT 2022 | stephendo
And pin outs of both. Once I saw a SOT-6 replaced with a miniSOT-6 (IIRC) The pin outs of the two parts were different. We did make an adaptor board and it wasn't too bad. We populated a panel of the adaptor boards, depanelized them and put them in t
Used SMT Equipment | Pick and Place/Feeders
Fuji AIm P&P Pacakge with 400+ Feeders, Vitronics Soltec XPM3-1030 Reflow Oven, Asys Conveyors! Make: Fuji Model: AIM Quantity: Three SW: V5.BZA Single lane Machine 1 Vintage: 2006 Heads: 4 @ H12’s, (4) Feeder Trollies Hours: 32
Used SMT Equipment | Assembly Accessories
Description Lot# - 13360-97 Condition - Used/See Description Package Lot including all Lots except for Feeders, Changeover Tables and Docking Stations.This Lots contains below assets:ASM / Siemens Siplace 'SX-2' Placement Machine (2020)ASM
Industry News | 2003-02-27 08:41:52.0
Elec & Eltek International Co. Ltd. (
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Parts & Supplies | SMT Equipment
Smt nozzles Casio H06 H2 H32 HS1 nozzles used in pick and place machine Smt 8800 machine:HS1/HIM/H2/H2M/H06/H7/H07/H21/H22/H23/H24/H31/H32/H33/H34/H35 Smt nozzle Models: M1 7000 PICK UP NOZZLEφ1.5/φ0.45 M2 7000 PICK UPNOZZLEφ1.0/φ0.4 M7 7000 PI
Technical Library | 2024-09-19 15:55:23.0
What steps are taken to ensure ESD safety for laser depanel process.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
Check more detail for PCB stacker: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/97.html PCB stacker and bare board PCB loader use for automatic PCB bare board production line that can save more labor cost and without the magazin
Events Calendar | Wed Jul 13 00:00:00 EDT 2022 - Wed Jul 13 00:00:00 EDT 2022 | Oshkosh, Wisconsin USA
Wisconsin Chapter: PCB Workshop and PCB Plant Tour
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
SMTnet Express, April 27, 2017, Subscribers: 30,419, Companies: 10,583, Users: 23,183 Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling Ahne Oosterhof, Eastwood Consulting. Using modern laser
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Setup-Sheet-850-003.pdf
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