VP-2800HP-CL62-2H 2 heads 3x Analog cameras / HD camera upgrade possible 6 slot nozzle changer Optional dispenser head 62x 8mm CL Feeder slots in 2 bays 35x 8mm push feeder on West side included Optional paste / glue dispenser module Option
Parts & Supplies | SMT Equipment
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Infineon New and Original F3L200R12W2H3-B11 in Stock MODULE package Infineon New and Original F3L200R12W2H3-B11 in Stock MODULE package Infineon New and Original F3L200R12W2H3-B11 in Stock MODULE package Packaging & Shipping 1. Delivery w
Industry News | 2001-11-13 08:48:13.0
CEERIS Benchmarking Reports
Industry News | 2001-12-29 09:38:05.0
This opportunity ends with the end of 2001
Technical Library | 2011-09-26 03:33:31.0
How to repair flash drive documents when missing due to malicious software installations? Company presents drive recovery software to restore digital files and compressed folders from accidently formatted usb removable media drives.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Technical Library | 2017-03-09 17:37:05.0
This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag.
TI New and Original UCC2813QDR-2Q1 in Stock IC SOP8 16+ package UCC2813QDR-2Q1 Economical Low Power BICMOS 1MHz Current Mode PWM with 12.5V/8.3V UVLO, 100% Duty Cycle, –40°C to 85°C Temperature THVD1410DR SOP8 TI 21+ LM337TG TO220 ON 22+ IS
TI New and Original ISO7762DBQR in Stock IC SSOP16 21+ package ISO7762DBQR Six-Channel, 4/2, Reinforced Digital Isolator with Superior EMC Performance THVD1410DR SOP8 TI 21+ LM337TG TO220 ON 22+ IS31LT3505-SLS2-TR SOP ISSI 15+ TCAN1051DRQ1
