Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez
Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Used SMT Equipment | General Purpose Equipment
FEATHERS The solder paste miser efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil printing and reflowing processes. The use of the mixer also reduces the chances of absorbing air moistur
Industry News | 2019-09-12 22:51:52.0
Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.
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Baja Bid will be selling some electronic manufacturing equipment from the Creation Technologies site in Lexington, KY. The bidding period opens on March 2nd and closes on March 18th.
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
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Troubleshoot & Maintain: Siemens (Siplace) placement machines, JOT, MPM Maintain and repair Siplace Placement Feeder Operating SMT equipment during normal production runs Ensuring the highest quality of the paste printing, placement, and reflow p
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SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd
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