Used SMT Equipment | SMT Equipment
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Used SMT Equipment | Chipshooters / Chip Mounters
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Used SMT Equipment | Chipshooters / Chip Mounters
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Used SMT Equipment | SMT Equipment
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg jenny@ksunsmt.com
Used SMT Equipment | SMT Equipment
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg If any more requirement pls send me mail to sheryl@ksunsmt.com
Used SMT Equipment | SMT Equipment
Model :FX-3R Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg If any more requirement ,pls send me email to sheryl@ksunsmt.com
Used SMT Equipment | SMT Equipment
Model :FX-3R Pick and Place Machine Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg
Used SMT Equipment | Pick and Place/Feeders
Model :FX-3R PICK AND PLACE MACHINE Placement speed：Chips:90000CPH(0.04sec/chip) Component mount range:0402 chips ~33.5mm Station:160 Power supply:200-415(V) Size:2,650x1, 650x1, 530mm Weight:3,100kg Currently, all the machines with very good
Parts & Supplies | Pick and Place/Feeders
Klueberalfa DH 3-100, 50ml
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
