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EWS-310 Wave Soldering Machine

EWS-310 Wave Soldering Machine

New Equipment | Wave Soldering

Economic, low to medium, automatic, 11.8" (310mm) wave soldering system with "L" finger conveyor for pallet or pallet-less board transport. The EWS-310 Wave Soldering Machine provides quick loading of PCBs from the onload conveyer extensions onto t

DDM Novastar Inc

Fuji QP3 NOZZLES

Fuji QP3 NOZZLES

Parts & Supplies | Pick and Place/Feeders

ADBPN-8523 FUJI QP3 0.7mm, 10mm LONG CONE NOZZLE ADBPN-8530 FUJI QP3 1.0mm, 10mm LONG CONE NOZZLE ADBPN-8544 FUJI QP3 1.3mm, 10mm LONG CONE NOZZLE ADBPN-8113 FUJI QP3 1.3mm, 27mm LONG NOZZLE ADBPN-8120 FUJI QP3 1.8mm, 27mm LONG NOZZLE ADBPN-8167

SMT Parts, Inc.

Plexus Announces Q2 Revenue of $191 Million, EPS Loss of $(0.12)

Industry News | 2003-04-25 08:01:00.0

Initiates Q3 revenue guidance of $190 - $200 million, Outlines $12 million restructuring plan

Plexus Corporation

Fuji Cutter, belts..

Fuji Cutter, belts..

Parts & Supplies | SMT Equipment

Supply smt/ai spare parts; CP6切刀(定刀)WPK0240    CP6方气缸带阀WPA5142   CP6方气缸WPA5152    CP6圆气缸S2085H    CP6 HOLDER:AWPH3115    CP6 小shaft杆:WPH3120    CP6 真空阀WPH1182    CP6 万向节K1005Z    CP6磨茹头WPH1282/WPH1284    CP6 JOINT杆AWPL8012    CP6切刀(定刀)WPK

ShenZhen SiMTai Electronics CO.,Ltd.

Panasonic PANASONIC VALVE

Panasonic PANASONIC VALVE

Parts & Supplies | Pick and Place/Feeders

Panasonic  BM221 Modular Placement Machine   1086289282 FILTER - (0.00) Panasonic  BM221 Modular Placement Machine   1086209530 FILTER UNIT - (0.00) Panasonic  BM221 Modular Placement Machine   N986YYYY-T83 BOLT M3X8 - (0.00) Panasonic  BM221 M

Goodluck Electronic Equipment Co., Ltd

Ag/Pd Component Finish

Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR

We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

Sm t t net
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