Electronics Forum | Tue May 16 16:54:14 EDT 2000 | Ashok Dhawan
For a typical assembly facility ( where assembly of circuit cards and shelves is carried out), what are usual recommendation for : 1.Ambient conditions ( Temp and Relative Humidity) 2.Use of Smocks If humidity is less than 40%, what are special prov
Electronics Forum | Mon May 06 21:40:40 EDT 2013 | davef
ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity limits
Electronics Forum | Thu Jun 06 15:52:38 EDT 2002 | dason_c
It is normal recommended by the paste supplier. Indium paste claim that it can worked on high temp/RH area. Also, check Aim solder web site and they have a good solder paste handling guideline. Internally, we control our environment not exceed 27C
Electronics Forum | Mon Mar 19 10:35:44 EDT 2007 | dyoungquist
We use a no-clean lead free paste with our manufacturing floor temp 70-75F and humidity 20%-30%. We have found that if the time from pasting a board until it goes into our reflow oven is less than 4 hours we have no problems. If it is greater than
Electronics Forum | Tue Dec 21 17:56:13 EST 2010 | stepheniii
Am I reading your post correctly? You will print PCBs and not populate them until up to 24 hours later? And you can assemble level 3 components at 30C and 90% humidity, you just have to pro-rate the exposure time. (I don't recommend having those con
Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef
Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity
Electronics Forum | Wed Jun 21 05:14:49 EDT 2000 | Wolfgang Busko
Hi Ivan, J-STD-001C chapter 3.6.2 says temperature should be maintained between 18�C and 30�C and humidity should not exceed 70% and below 30% verification of electrostatic discharge control is advised. This is a wide range and I wouldn�t allow a sw
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer
Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu
Electronics Forum | Thu Feb 16 18:14:45 EST 2006 | Geo E
We have just purchased a humidity logger and I need to know what the relitive humidity should be in a SMT production area. The Room is enclosed approx. 60ft by 30ft using ESD Floor tile. 3 machines are in the room as well as some Thru hole machines.
