Full Site - : 30% humidity (Page 18 of 29)

SMT room environment

Electronics Forum | Tue Jan 10 16:01:20 EST 2017 | davef

A review document for J-STD-001F with Amendment 1 had the following wording, but you should check the actual document to be sure of correctness 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at le

Humidity in SMT room

Electronics Forum | Fri Feb 17 07:43:09 EST 2006 | davef

ANSI-J-STD-001 says words to the effect: 18-30*C, 30-70%RH

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

Air Moisture in Production

Electronics Forum | Thu Dec 09 10:40:45 EST 2010 | grahamcooper22

MSL 3 means you can have the devices open for a maximum of 168 hours in an atmosphere of less then or equal to 30 C and 60% RH. If the humidity is less then 60% then it means the devices will absorb less moisture in a given time, but even at 40% RH y

Humidity in SMT room

Electronics Forum | Fri Feb 17 10:32:50 EST 2006 | SuMoTe

We shoot for 35, but will take 30.

Solder Shelf Life

Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef

In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory

Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound

Re: QFP storage systems

Electronics Forum | Sun Oct 18 01:55:16 EDT 1998 | PARK KYUNG SAM

WE USE 3 chamber OF Mc-DRY(MODEL NAME). THE MACHINE CAN REMOVE HUMIDITY FROM PARTS IN THE GENERAL PERIPHERAL TEMPERATURE (MAY BE 25-30;CENTIGRADE). AND IT'S CONVENIENT FOR MAN TO PUT OR TAKE OUT COMPANENT FROM CHAMBER BECAUSE THERE IS NO HOT AIR AN

Moisture absorption in the solder paste

Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman

Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill

Re: Humidity Of Assembly Area

Electronics Forum | Thu Nov 04 15:28:53 EST 1999 | Dave F

Whoa Scott, them's serious numbers!!! ;-) But then again, it depends on what you're doing doesn't it? Chris: Try ANSI-J-STD-001, which says 18-30�C, 30-70%RH Good luck Dave F


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