Expedition Enterprise™ Provides highly integrated, comprehensive PCB design-to-manufacturing tools that promote collaboration across the extended enterprise. Expedition Enterprise™ from Mentor Graphics is the industry’s most innovative PCB design f
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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Electronics Forum | Fri Sep 20 13:57:46 EDT 2002 | bdoyle
I figured I would start a new thread about this to keep it focused. How old is a thread when its considered old? In otherwords, when should we lock it? 30/60/90 days? two weeks?
Electronics Forum | Tue Nov 23 08:46:19 EST 2004 | mmjm_1099
Has anyone else used the Multi-Job Balancer? I am considering this but of course cost is slowing down the decision making. On average we do a 30-60 feeder setup and switch out to about 4 jobs a day. So any input would be highly appreciated.
Electronics Forum | Wed Dec 22 21:14:53 EST 2004 | davef
IPC-FA-251 recommends 121*C for 30-60 minutes for 1 and 2 flex layer circuits. A rigid flex can take easily an hour per layer depending on the construction.
