ProntoSELECTIVE-SOLDERING is used by electronic manufacturers to quickly program their Selective Soldering machines. ProntoSELECTIVE-SOLDERING helps program most popular Selective Soldering machines such as ACE Production Technologies, RPS Autom
New Equipment | Education/Training
Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code
Used SMT Equipment | Soldering - Reflow
This SMTmax WP-5500 Reflow Oven is available for bidding in our upcoming online auction. Bidding opens on 7/9/24 and begins closing on 7/10/24. Click the following link for more information: https://bajabid.com/zelpro-solutions/
Used SMT Equipment | Chipshooters / Chip Mounters
Universal 4688A SMT Pick & Place Approx. Dimensions: 86" x 66" x 60" Item Location: Laval, QC Canada Features: Dual Beam 7 Spindle (FlexJet} Placement Heads Per Beam
Industry News | 2003-02-26 08:37:36.0
An extended-height press-fit compliant pin SCA-2 receptacle is the latest addition to the SCA-2 product family.
Industry News | 2003-05-12 09:44:36.0
The actual number turned out to be substantially lower mainly due to internal personnel arrangements
Parts & Supplies | General Purpose Equipment
The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room applications. A quality tool for the technician but inexpensive enough to meet the budgetary requirement of modern manufacturing. /8" Mirror He
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2017-06-29 15:41:36.0
What's the most cost-effective method for testing prototype PCBs? Should the assembler do it, or the client's in-house engineers? This article explains all.
Training Courses | ON DEMAND | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Training Courses | ON DEMAND | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Career Center | Sugar Land, Texas USA | Production
Ability to assemble from blueprints/schematics. Previous experience with mechanical/electrical buildouts. Familiarity with tools and equipment for general assembly. Some positions require travel to the Austin, TX area for training. Living expense
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: Experience in injection mold plastics; working with various machinery, optimization; reduction of scrap; increase productivity work with Technicians. Duties/Functions: Develop optimization / troubleshooting program with guidance
Career Center | 厦门, China | Sales/Marketing
It supplies automation components to heavy industry manufacturers around the world. We have plc, DCS, operation panel, servo drive and servo motor, excitation plate, other electrical equipment accessories inventory, also provide production products.
Career Center | , | Sales/Marketing
Sales Engineer/Manager/Representative in electronics and publication/newspaper industries
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/products/selective-soldering-systems/cerno-105il
. Features and Benefits Selective soldering of printed circuit boards as large as 914 x 711 mm (36.0 x 28.0 in.) with the included carriers Heavy duty non-SMEMA edge conveyor to support added weight of large backplanes, PCBs or tooling fixtures Interchangeable solder pots and pumps compatible with tin-lead
